THERMAL POLYMER
THE THERMAL POLYMER
Heavy duty circuitry has extremely high energy requirements and gives off excess heat, of which does not disperse properly with common IC packaging, resulting in circuit burndown.
Today's IC packages are made with thermal polymers with maximum thermal conductivities of 2 to 3 W/m.K, but it is not enough for certain applications. Our thermal polymer embedded with hybrid nanoparticles has the potential of reaching 7 to even 10 W/m.K.
THE THERMAL POLYMER
We are developing a non-toxic thermal polymer that softens at higher temperatures allowing a high-resolution printing 3D structure. This thermal polymer is immutable after its first use and can be used to store fingerprints for an extra layer of security identification.
PolyMaterials is optimizing the molding and curing characteristics of the thermal polymer aiming for a more robust, thin film 3D prints using only the heat provider. Our new technology has easy and versatile integration capabilities for companies that wish to add this security layer to ID cards, drivers licenses, credit cards and passports.
