Thermal Polymer

Heavy duty circuitry has extremely high energy requirements and gives off excess heat, of which does not disperse properly with common IC packaging, resulting in circuit burndown.

 

Today's IC packages are made with thermal polymers with maximum thermal conductivities of 2 to 3 W/m.K, but it is not enough for certain applications. Our thermal polymer embedded with hybrid nanoparticles has the potential of reaching 7 to even 10 W/m.K.