Thermal Polymer

Heavy duty circuitry has extremely high energy requirements and gives off excess heat, of which does not disperse properly with common IC packaging, resulting in circuit burndown.


Today's IC packages are made with thermal polymers with maximum thermal conductivities of 2 to 3 W/m.K, but it is not enough for certain applications. Our thermal polymer embedded with hybrid nanoparticles has the potential of reaching 7 to even 10 W/m.K.


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There is no need to only imagine what the future holds, come and see.

Manoj K. Ram, CEO

o 727.233.1018      c 727.251.3098

3802 Spectrum Blvd, Suite  201

Tampa, FL 33612