Thermal Polymer

Heavy duty circuitry has extremely high energy requirements and gives off excess heat, of which does not disperse properly with common IC packaging, resulting in circuit burndown.

 

Today's IC packages are made with thermal polymers with maximum thermal conductivities of 2 to 3 W/m.K, but it is not enough for certain applications. Our thermal polymer embedded with hybrid nanoparticles has the potential of reaching 7 to even 10 W/m.K.

Collaborate 

           with us

                

If you wish to get involved in our projects or have an idea that needs an extra push to come into existence, then reach out.

 

 

There is no need to only imagine what the future holds, come and see.

Manoj K. Ram, CEO

 

manoj.ram@polymaterialsapp.com

o 727.233.1018      c 727.251.3098

3802 Spectrum Blvd, Suite 145

Tampa, FL 33612